just finished laminating my first board and have a few small hollow gaps along the deck side cut lap lines (tinted PU resin). my cut lap lines were a little tall, and when I laminated over them it left a small void along the cut lap. I am worried about delamination getting worse here. I was considering injecting sine resin into these little voids to help prevent them from getting worse over time. They are about 1/8 to 1/4" wide and run about 18" down either side of the board.
Is this a bad idea, or something that could work? My biggest concern is if curing resin puts off a gas and might build up pressure between the foam and fiberglass, and cause further problems.
It would work fine. You wont have problems with gassing.
In the future, get a simple tool called a wallpaper seam roller and use that to press the cutlap down into the foam to make it sit flush. Takes a littel bit of pressure so don;t feel like your hurting the board. Jsut enough to get the edge of the cutlap flush. This way the top layer of cloth sits perfectly. You can purchase this tool at a paint/wallpaper store. It’s about $8 dollars and will solve that problem.
Great, thanks. Not sure if leaving it alone will cause it to continue to delam with use of the board. Filling it seems like a better option.
I had read that about the roller. It seemed like for some reason it was always on posts about epoxy resin, so I just made the connection that you ONLY use it with epoxy.
Do you roll it right after making the cut, and before a full cure on the lap?
“Sine resin” is when I am typing “some resin” on my phone and it screws it up.
I wasn’t planning on cutting the bubble open. I was going to poke a pin through and use a syringe to fill it. I’m not too concerned with the LOOK of the bubble , but more so worrying about causing more separation over time. I just can’t do a pin line with the look of my board I’m going for.